Packaging Engineer (Start ASAP)

Join Texas Instruments as a Packaging Engineer to innovate semiconductor packaging technologies for high-performance products.

Your Role

Key responsibilities as follows:

• Interface across various work areas to design, develop, and analyze semiconductor packaging technologies.
• Collaborate with businesses to create solutions for Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
• Participate in cross-functional teams to support product qualification and production.
• Direct design-of-experiments and work with suppliers to select innovative packaging materials.
• Conduct electrical, mechanical, and thermal models to establish design rules and prevent high-risk designs.

About You

The ideal candidate will have:

• A Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science, Physics, or Electrical Engineering.
• A cumulative GPA of 3.0/4.0 or higher.
• Basic understanding of statistical process control (SPC) and semiconductor packaging knowledge.
• Demonstrated analytical and problem-solving skills.
• Strong written and verbal communication skills.
• Ability to work effectively in teams and manage time efficiently.
• Initiative and drive for results in a fast-paced environment.

Benefits

Texas Instruments offers competitive pay and benefits designed to support you and your family, including healthcare and other perks.

Training & Development

Opportunities for professional growth and development are provided, including mentorship and training programs.

Career Progression

Potential for career advancement is available, with opportunities to grow within the company over the next few years.

How to Apply

Interested candidates should apply by submitting their application through the specified process.

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