Hardware Product Engineer - Intern (Start ASAP)

Hardware Product Engineer

Board Solutions is a central team within NXP’s CTO organization responsible for the design, manufacturing, compliance, and supply chain operations of PCB boards. The organization provides a one-stop solution to all business lines within NXP through its global presence in the US, EU, and Asia. Business Lines include Advanced Analog, Automotive Embedded Systems, and Secure Connected Edge.

We now offer the technical position of Hardware Product Engineer Intern for NXP’s Board Solutions in Shanghai, responsible for all aspects of the product development cycle from the concept and design to the manufacture, packaging, delivery, and quality of the hardware products.

Responsibilities:

• Responsible for ensuring products meet all mechanical requirements, including boards, cables, enclosures, and systems
• Develop new sockets for silicon tests based on test requirements, such as reliability sockets, silicon validation sockets, FA sockets, etc.
• Design a new package for NPI product packing.
• Collaborate with the design engineer, CAD Layout, and test engineer to release system solutions that adhere to DFM guidelines and meet schedule requirements.
• Review layout requirements, layout, Gerber, and BOM data to ensure the component population is accurate and corresponds to contract manufacturer (CM) processes, industry standards, and compliance.
• Incorporate with CM production line equipment, process capability to perform DFM review activity to optimize layout components placement.
• Generate Change Orders and Corrective Actions to release product engineering data for NPI and sustaining products. Changes should incorporate feedback from contract manufacturers (CMs). Release board assembly instructions documents to guide CM to assemble the board, assemble the board with enclosures, and take caution on some key points during assembly.
• Responsible for identifying and communicating manufacturing risks & resolutions to BL partners and the project team. Perform board assembly feasibility & risk analysis for specific board assembly processes from BL TRD (technical requirements), such as press-fit, ultrasonic clean, conformal coating, and underfill process.
• Be familiar with PCB assembly processes, such as SMT, de-panel, wave solder/selective wave solder, press-fit, conformal coating, underfill, etc.
• Perform First Article and incoming inspection for PCBA & mechanical parts and assemblies
• Interact with CMs to resolve assembly and manufacturing issues, improve yields for NPI, and sustain products
• Ensure engineering data is complete and approved by all stakeholders and input build packages into Ara's manufacturing database for each product release
• Comprehensive knowledge of BOM structure and change control processes
• Work cross-functionally to ensure the resolution of problems and actions as needed

Requirements:

• Bachelor's or Master’s degree in electronics, product & industrial design, mechanical design, or a related field 
• Experience in one or more of the following areas is a plus:  PCB fabrication, PCB assembly, PCB DFM/DFA, Component Engineering, Mechanical Design, Thermal Simulation, and Product Lifecycle Management.
• Experience with CAD software such as AutoCAD, Solidworks, Pro-E, CAM350, Allegro, Graphicode, etc. is a plus.
• Excellent interpersonal and communication skills, English proficiency, good teamwork adaptability, self-motivation

Career Development Opportunities:

Bright Minds. Bright Futures.

We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.